Research Article
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Year 2023, Volume: 12 Issue: 4, 1094 - 1104, 28.12.2023
https://doi.org/10.17798/bitlisfen.1337326

Abstract

References

  • [1] M. Ha and S. Graham, “Development of a thermal resistance model for chip-on-board packaging of high power LED arrays,” Microelectron. Reliab., vol. 52, no. 5, pp. 836–844, 2012.
  • [2] H. Yang, B. Yang, J. Li, and P. Yang, “Failure analysis and reliability reinforcement on gold wire in high-power COB-LED under current and thermal shock combined loading,” Appl. Therm. Eng., vol. 150, pp. 1046–1053, 2019.
  • [3] C.-Y. Kang, C.-H. Lin, T. Wu, P.-T. Lee, Z. Chen, and H.-C. Kuo, “A novel liquid packaging structure of deep-ultraviolet light-emitting diodes to enhance the light-extraction efficiency,” Crystals (Basel), vol. 9, no. 4, p. 203, 2019.
  • [4] Z. Xia, S. Liang, B. Li, F. Wang, and D. Zhang, “Influence on temperature distribution of COB deep UV LED due to different packaging density and substrate type,” Optik (Stuttg.), vol. 231, no. 166392, p. 166392, 2021.
  • [5] G. Song, D.-H. Kim, D.-H. Song, J.-B. Sung, and S.-J. Yook, “Heat-dissipation performance of cylindrical heat sink with perforated fins,” Int. J. Therm. Sci., vol. 170, no. 107132, p. 107132, 2021.
  • [6] Z. Xu, “Thermal performance and multi-objective optimization of thermosyphon heat sinks with rectangular radial fins for high power LED lamps cooling,” Case Stud. Therm. Eng., vol. 30, no. 101778, p. 101778, 2022.
  • [7] M. Azarifar, C. Cengiz, and M. Arik, “Thermal and optical performance characterization of bare and phosphor converted LEDs through package level immersion cooling,” Int. J. Heat Mass Transf., vol. 189, no. 122607, p. 122607, 2022.
  • [8] Y. Jiu, H. Fan, and W. Wang, “Investigation of a novel natural convection heat sink for LEDs based on U-shaped mini-heat pipe arrays,” Appl. Therm. Eng., vol. 204, no. 118000, p. 118000, 2022.
  • [9] M. B. Ben Hamida, M. A. Almeshaal, K. Hajlaoui, and Y. A. Rothan, “A three-dimensional thermal management study for cooling a square Light Edding Diode,” Case Stud. Therm. Eng., vol. 27, no. 101223, p. 101223, 2021.
  • [10] Rammohan, R. Kumar, and Chandramohan, “Experimental analysis on estimating junction temperature and service life of high power LED array,” Microelectron. Reliab., vol. 120, no. 114121, p. 114121, 2021.
  • [11] S.-H. Moon, Y.-W. Park, and H.-M. Yang, “A single unit cooling fins aluminum flat heat pipe for 100 W socket type COB LED lamp,” Appl. Therm. Eng., vol. 126, pp. 1164–1169, 2017.
  • [12] D. H. Shin, D. K. Sohn, and H. S. Ko, “Analysis of thermal flow around heat sink with ionic wind for high-power LED,” Appl. Therm. Eng., vol. 143, pp. 376–384, 2018.
  • [13] B. S. Lazarov, O. Sigmund, K. E. Meyer, and J. Alexandersen, “Experimental validation of additively manufactured optimized shapes for passive cooling,” Appl. Energy, vol. 226, pp. 330–339, 2018.
  • [14] H.-H. Wu, K.-H. Lin, and S.-T. Lin, “A study on the heat dissipation of high power multi-chip COB LEDs,” Microelectronics, vol. 43, no. 4, pp. 280–287, 2012.
  • [15] W. J. Minkowycz, E. M. Sparrow, and J. Y. Murthy, Eds., Handbook of numerical heat transfer, 2nd ed. Nashville, TN: John Wiley & Sons, 2008.
  • [16] M. Sosnowski, J. Krzywanski, K. Grabowska, and R. Gnatowska, “Polyhedral meshing in numerical analysis of conjugate heat transfer,” EPJ Web Conf., vol. 180, p. 02096, 2018.
  • [17] T. W. Simpson, A. J. Booker, D. Ghosh, A. A. Giunta, P. N. Koch, and R.-J. Yang, “Approximation methods in multidisciplinary analysis and optimization: a panel discussion,” Struct. Multidiscipl. Optim., vol. 27, no. 5, 2004.
  • [18] O. Kalkan, A. Celen, and K. Bakirci, “Multi-objective optimization of a mini channeled cold plate for using thermal management of a Li-Ion battery,” Energy, vol. 251, no. 123949, p. 123949, 2022.
  • [19] N. R. Smalheiser, Data literacy: How to make your experiments robust and reproducible. San Diego, CA: Academic Press, 2017.
  • [20] O. Kalkan, “Multi-objective optimization of a liquid metal cooled heat sink for electronic cooling applications,” Int. J. Therm. Sci., vol. 190, no. 108325, p. 108325, 2023.
  • [21] M. Mobin, M. Mobin, and Z. Li, “Multi-response optimisation of cavitation peening parameters for improving fatigue performance using the desirability function approach,” Int. J. Appl. Decis. Sci., vol. 9, no. 2, p. 156, 2016.
  • [22] T. Zhang and B. Yang, “Box–cox transformation in big data,” Technometrics, vol. 59, no. 2, pp. 189–201, 2017.
  • [23] S.-H. Yu, K.-S. Lee, and S.-J. Yook, “Optimum design of a radial heat sink under natural convection,” Int. J. Heat Mass Transf., vol. 54, no. 11–12, pp. 2499–2505, 2011.

Development of Chip Temperature and Cost-Based Optimum Design for a Radial Heat Sink Cooling High Power LEDs

Year 2023, Volume: 12 Issue: 4, 1094 - 1104, 28.12.2023
https://doi.org/10.17798/bitlisfen.1337326

Abstract

High power Light Emitting Diodes (LED)s are preferred in places that produce intense light output and have overheating problems because they work with high currents. Therefore, efficient thermal management is essential to ensure optimal performance and longevity. In the present study, a numerical analysis is conducted on a high-power Light Emitting Diode (LED) circuit with a Circuit on Board (COB) design featuring a radial heat sink. Additionally, a multi-objective optimization approach using the Desirability Function Approach (DFA) is introduced for the modeled radial heat sink. Two performance parameters, namely the maximum junction temperature and the cost of the radial heat sink, are defined as the objective functions, and the aim is to minimize both of these parameters. The independent variables for the objective functions are the geometrical parameters of the radial heat sink, namely the base radius (R), fin length (L), and heat sink height (H). The Response Surface Method (RSM) is applied to minimize sample numbers of the Design of Experiment (DOE) while still obtaining accurate response values. Furthermore, Analysis of Variance (ANOVA) is utilized to assess the fitting of the real response equations with the representative answer equations. The minimum prediction R2 is calculated to be 0.9748%, indicating a good agreement between the models. The optimum design for the radial heat sink is obtained, with the following dimensions: R=25 mm, L=15 mm, and H=55.36 mm. The response values for this optimal design are validated with a low error rate of 0.25% using numerical analysis.

References

  • [1] M. Ha and S. Graham, “Development of a thermal resistance model for chip-on-board packaging of high power LED arrays,” Microelectron. Reliab., vol. 52, no. 5, pp. 836–844, 2012.
  • [2] H. Yang, B. Yang, J. Li, and P. Yang, “Failure analysis and reliability reinforcement on gold wire in high-power COB-LED under current and thermal shock combined loading,” Appl. Therm. Eng., vol. 150, pp. 1046–1053, 2019.
  • [3] C.-Y. Kang, C.-H. Lin, T. Wu, P.-T. Lee, Z. Chen, and H.-C. Kuo, “A novel liquid packaging structure of deep-ultraviolet light-emitting diodes to enhance the light-extraction efficiency,” Crystals (Basel), vol. 9, no. 4, p. 203, 2019.
  • [4] Z. Xia, S. Liang, B. Li, F. Wang, and D. Zhang, “Influence on temperature distribution of COB deep UV LED due to different packaging density and substrate type,” Optik (Stuttg.), vol. 231, no. 166392, p. 166392, 2021.
  • [5] G. Song, D.-H. Kim, D.-H. Song, J.-B. Sung, and S.-J. Yook, “Heat-dissipation performance of cylindrical heat sink with perforated fins,” Int. J. Therm. Sci., vol. 170, no. 107132, p. 107132, 2021.
  • [6] Z. Xu, “Thermal performance and multi-objective optimization of thermosyphon heat sinks with rectangular radial fins for high power LED lamps cooling,” Case Stud. Therm. Eng., vol. 30, no. 101778, p. 101778, 2022.
  • [7] M. Azarifar, C. Cengiz, and M. Arik, “Thermal and optical performance characterization of bare and phosphor converted LEDs through package level immersion cooling,” Int. J. Heat Mass Transf., vol. 189, no. 122607, p. 122607, 2022.
  • [8] Y. Jiu, H. Fan, and W. Wang, “Investigation of a novel natural convection heat sink for LEDs based on U-shaped mini-heat pipe arrays,” Appl. Therm. Eng., vol. 204, no. 118000, p. 118000, 2022.
  • [9] M. B. Ben Hamida, M. A. Almeshaal, K. Hajlaoui, and Y. A. Rothan, “A three-dimensional thermal management study for cooling a square Light Edding Diode,” Case Stud. Therm. Eng., vol. 27, no. 101223, p. 101223, 2021.
  • [10] Rammohan, R. Kumar, and Chandramohan, “Experimental analysis on estimating junction temperature and service life of high power LED array,” Microelectron. Reliab., vol. 120, no. 114121, p. 114121, 2021.
  • [11] S.-H. Moon, Y.-W. Park, and H.-M. Yang, “A single unit cooling fins aluminum flat heat pipe for 100 W socket type COB LED lamp,” Appl. Therm. Eng., vol. 126, pp. 1164–1169, 2017.
  • [12] D. H. Shin, D. K. Sohn, and H. S. Ko, “Analysis of thermal flow around heat sink with ionic wind for high-power LED,” Appl. Therm. Eng., vol. 143, pp. 376–384, 2018.
  • [13] B. S. Lazarov, O. Sigmund, K. E. Meyer, and J. Alexandersen, “Experimental validation of additively manufactured optimized shapes for passive cooling,” Appl. Energy, vol. 226, pp. 330–339, 2018.
  • [14] H.-H. Wu, K.-H. Lin, and S.-T. Lin, “A study on the heat dissipation of high power multi-chip COB LEDs,” Microelectronics, vol. 43, no. 4, pp. 280–287, 2012.
  • [15] W. J. Minkowycz, E. M. Sparrow, and J. Y. Murthy, Eds., Handbook of numerical heat transfer, 2nd ed. Nashville, TN: John Wiley & Sons, 2008.
  • [16] M. Sosnowski, J. Krzywanski, K. Grabowska, and R. Gnatowska, “Polyhedral meshing in numerical analysis of conjugate heat transfer,” EPJ Web Conf., vol. 180, p. 02096, 2018.
  • [17] T. W. Simpson, A. J. Booker, D. Ghosh, A. A. Giunta, P. N. Koch, and R.-J. Yang, “Approximation methods in multidisciplinary analysis and optimization: a panel discussion,” Struct. Multidiscipl. Optim., vol. 27, no. 5, 2004.
  • [18] O. Kalkan, A. Celen, and K. Bakirci, “Multi-objective optimization of a mini channeled cold plate for using thermal management of a Li-Ion battery,” Energy, vol. 251, no. 123949, p. 123949, 2022.
  • [19] N. R. Smalheiser, Data literacy: How to make your experiments robust and reproducible. San Diego, CA: Academic Press, 2017.
  • [20] O. Kalkan, “Multi-objective optimization of a liquid metal cooled heat sink for electronic cooling applications,” Int. J. Therm. Sci., vol. 190, no. 108325, p. 108325, 2023.
  • [21] M. Mobin, M. Mobin, and Z. Li, “Multi-response optimisation of cavitation peening parameters for improving fatigue performance using the desirability function approach,” Int. J. Appl. Decis. Sci., vol. 9, no. 2, p. 156, 2016.
  • [22] T. Zhang and B. Yang, “Box–cox transformation in big data,” Technometrics, vol. 59, no. 2, pp. 189–201, 2017.
  • [23] S.-H. Yu, K.-S. Lee, and S.-J. Yook, “Optimum design of a radial heat sink under natural convection,” Int. J. Heat Mass Transf., vol. 54, no. 11–12, pp. 2499–2505, 2011.
There are 23 citations in total.

Details

Primary Language English
Subjects Energy, Optimization Techniques in Mechanical Engineering, Numerical Methods in Mechanical Engineering
Journal Section Araştırma Makalesi
Authors

Orhan Kalkan 0000-0002-9664-1819

Early Pub Date December 25, 2023
Publication Date December 28, 2023
Submission Date August 3, 2023
Acceptance Date November 17, 2023
Published in Issue Year 2023 Volume: 12 Issue: 4

Cite

IEEE O. Kalkan, “Development of Chip Temperature and Cost-Based Optimum Design for a Radial Heat Sink Cooling High Power LEDs”, Bitlis Eren Üniversitesi Fen Bilimleri Dergisi, vol. 12, no. 4, pp. 1094–1104, 2023, doi: 10.17798/bitlisfen.1337326.

Bitlis Eren University
Journal of Science Editor
Bitlis Eren University Graduate Institute
Bes Minare Mah. Ahmet Eren Bulvari, Merkez Kampus, 13000 BITLIS